We have a dual-chamber magnetron sputtering tool with dc and rf deposition capabilities. Chambers are dedicated to metal and oxide deposition, respectively, with a separate load lock chamber. We can deposit from two different targets simultaneously (co-deposition) in both chambers, and they can operate independently. Currently, the two chambers accommodate nine targets with a possibility of an upgrade up to seventeen. The oxide chamber has a gun for off-axis deposition, a unique feature to deposit stoichiometric films from multi-element targets. Reactive gases are also available (O2 and N2). The sample holder can rotate, be heated (up to 850°C), and apply a transverse magnetic field of 20 mT on the substrate during the deposition. Both chambers work at a base pressure in the low 10^8 Torr.
