Electroresistance in ultrathin Hf0.5Zr0.5O2 (HZO) films is pivotal toward the implementation of hafnia-based ferroelectrics in electronics. Here, we show that the electroresistance yield and endurance of large capacitors (∼314 µm2) of epitaxial HZO films only 2.2 nm thick grown on SrTiO3 or GdScO3 can be improved using 1 nm SrTiO3 capping layers. It is argued that the main role of the capping layer is to minimize charge transport along grain boundaries, and, thus, a similar strategy can be explored in polycrystalline films
Electroresistance in ultrathin Hf0.5Zr0.5O2 (HZO) films is pivotal toward the implementation of hafnia-based ferroelectrics in electronics. Here, we show that the electroresistance yield and endurance of large capacitors (∼314 µm2) of epitaxial HZO films only 2.2 nm thick grown on SrTiO3 or GdScO3 can be improved using 1 nm SrTiO3 capping layers. It is argued that the main role of the capping layer is to minimize charge transport along grain boundaries, and, thus, a similar strategy can be explored in polycrystalline films
